Gelid Solutions TP-GP01-C heat sink compound Thermal pad - Gelid

Beskrivning

The GP-Extreme is designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces such as micro-controller units, memory ICs, analog ICs, MOSFETs and other SMD components. Thanks to its softness and ultimate thermal conductivity the GP-Extreme fills spaces properly and offers the best performance in class. The GP-Extreme is non-electrical conductive, non-corrosive, non-curing and non-toxic. The GP-Extreme ensures an easy application and the thermal pad dimensions of 8040 mm optimally fit to large PCB surfaces of VGA cards, laptops, gaming consoles and other densely packed devices.

Weight & dimensions

• Width: 80 mm
• Depth: 40 mm
• Height: 1.5 mm

Packaging data

• Quantity per pack: 1 pc(s)

Features

• Type: Thermal pad
• Density: 2.8 g/c